Price chart (1D to 10Y)
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Valuation vs Instaport thresholds (P/E, PEG, P/FCF, P/S)
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Profile
From SEC filingsCompany description
We provide equipment, consumables and services for semiconductor device packaging, wafer production and device fabrication. Our products are used to fabricate and package semiconductor devices, such as graphic processing units (GPU’s) used in AI applications, silicon carbide (SiC) and silicon (Si) power devices and other optical, analog and digital devices. We sell these products to semiconductor device packaging, electronic assembly and device fabrication companies worldwide. Our Thermal Processing Solutions includes conveyorized reflow equipment for advanced semiconductor packaging and electronic assembly, high temperature conveyorized furnaces for power semiconductor substrate and electronic components manufacturing, and diffusion furnaces for (SIC) and (Si) power device production. Our Semiconductor Fabrication Solutions include consumables, equipment and services for wafer polishing, dicing and cleaning. Our strategy is to focus our efforts on fully capitalizing on advanced packaging equipment opportunities driven by AI infrastructure investments and expand our consumables and service business for semiconductor fabrication by providing exceptional service and high-quality products to underserved segments of the market.
Read the full filing description · filed 10 Dec 2025
At a glance
- Sector
- Technology
- Industry
- Special Industry Machinery, NEC
- CEO
- Inc. CEO
- Employees (2025)
- 264
- Incorporated in
- AZ
Sector is derived from the SEC industry classification.
Source: SEC filings. Information and analytics, not investment advice.