Price chart (1D to 10Y)
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Valuation vs Instaport thresholds (P/E, PEG, P/FCF, P/S)
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Profile
From SEC filingsCompany description
We supply advanced, innovative capital equipment developed for the global semiconductor industry. Our products are designed to address yield-critical and performance-sensitive process steps that become increasingly difficult as semiconductor devices scale to smaller geometries and more complex structures. We focus on developing differentiated process solutions that enable effective particle removal, uniform material deposition, and reliable process control, while helping customers manage cost of ownership, throughput, and environmental considerations. We believe this approach has supported broader adoption of our tools across multiple technology nodes and device types. Fabricators of advanced integrated circuits, or chips, can use our wet-cleaning, plating, furnace, PECVD, track, and other front-end processing equipment in numerous steps to improve product yield, even at increasingly advanced process nodes. We have designed these products for use in fabricating foundry, logic and memory chips, including dynamic random-access memory, or DRAM, and 3D NAND-flash memory chips. We also develop, manufacture and sell a range of advanced packaging equipment to wafer assembly and packaging customers. Revenue from single wafer cleaning, Tahoe and semi-critical cleaning equipment totaled $626.0 million, or 69.5% of total revenue in 2025, $578.9 million, or 74.0% of total revenue in 2024, and $403.9 million, or 72.4% of total revenue in 2023.
Read the full filing description · filed 2 Mar 2026
At a glance
- Sector
- Technology
- Industry
- Special Industry Machinery, NEC
- CEO
- David H. Wang
Source: SEC filings. Information and analytics, not investment advice.